TSM-DS3 PCB: 2-Layer, 30mil Core, 0.8mm Thickness with Immersion Gold Finish
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
Overview of TSM-DS3 2-Layer PCB
The TSM-DS3 PCB is a high-performance 2-layer rigid PCB designed for high-power, low-loss, and thermally stable applications. Built with TSM-DS3 materials, this PCB features a 30mil (0.762mm) core and a finished thickness of 0.8mm, providing low dielectric loss and excellent thermal conductivity.
With a dielectric constant (Dk) of 3.0 ± 0.05 and dissipation factor (Df) of 0.0014 at 10 GHz, the TSM-DS3 PCB is a reliable choice for radar systems, phased array antennas, and high-frequency automotive applications. The Immersion Gold (ENIG) surface finish ensures excellent solderability, corrosion resistance, and long-term durability.
PCB Construction Details
| Parameter | Specification |
| Base Material | TSM-DS3 |
| Layer Count | 2 layers |
| Board Dimensions | 68mm x 126mm |
| Minimum Trace/Space | 5/5 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | None |
| Finished Thickness | 0.8mm |
| Copper Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Gold (ENIG) |
| Top Silkscreen | White |
| Bottom Silkscreen | None |
| Top Solder Mask | Green |
| Bottom Solder Mask | None |
| Electrical Testing | 100% tested before shipment |
PCB Stackup
| Layer | Material | Thickness |
| Copper Layer 1 | Copper (1oz) | 35μm |
| Dielectric Layer | TSM-DS3 Core | 0.762mm (30mil) |
| Copper Layer 2 | Copper (1oz) | 35μm |
Introduction to TSM-DS3 Material
The TSM-DS3 laminates are ceramic-filled, reinforced materials with minimal fiberglass content (~5%), developed for high-power RF applications. These materials provide dimensional stability, low loss, and thermal reliability, combining the benefits of ceramics and traditional epoxy laminates.
Key Features of TSM-DS3
Dielectric Constant (Dk): 3.0 ± 0.05 at 10GHz / 23°C.
Dissipation Factor (Df): Low at 0.0014 at 10GHz.
Thermal Conductivity: 0.65 W/m·K for optimal heat dissipation.
Moisture Absorption: Extremely low at 0.07%.
CTE (Coefficient of Thermal Expansion): X-axis: 10 ppm/°C. Y-axis: 16 ppm/°C. Z-axis: 23 ppm/°C.
Temperature Stable Dk: ±0.25% from -30°C to 120°C.
Benefits of TSM-DS3
- Dimensional Stability: Rivals epoxy for large-format multilayer PCBs.
- Low Dielectric Loss: Suitable for high-frequency, low-loss designs.
- Thermal Stability: High thermal conductivity ensures reliable performance under high-power conditions.
- High Yield and Consistency: Compatible with standard PCB manufacturing processes.
- Resistive Foil Compatibility: Supports advanced circuit designs.
Applications
Couplers
Phased Array Antennas
Radar Manifolds
Millimeter Wave Antennas
Automotive Applications
Oil Drilling Equipment
Semiconductor/ATE Testing
Conclusion
The TSM-DS3 2-layer PCB is a premium solution for high-frequency, high-power PCB designs, offering low dielectric loss, thermal stability, and dimensional reliability. With its 30mil TSM-DS3 core, Immersion Gold finish, and green solder mask, this PCB is ideal for applications such as radar manifolds, phased array antennas, and semiconductor testing.
Compliant with IPC-Class-2 standards and available worldwide, the TSM-DS3 PCB is the perfect choice for engineers seeking cost-effective, high-performance materials for complex, high-frequency designs.
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TSM-DS3 PCB built on 30mil material | fabricating large format complex multilayers with Immersion Gold for RF microwave Images
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